It’s no surprise that there are a lot of development on NAND flash these few years. SSDs are taking over the world, and we know it. WD knows it. Maybe that’s why WD acquired SanDisk? WD struck the market with their brand new announcement of their brand new 3D NAND technology. They dub it as BiCS3, and has 64 layers of vertical storage capability.
It features 3-bits-per-cell technology, so it can pack way more capacitiy into a smaller area, which means higher density. BiSC3 is a joint development between Toshiba and Western Digital. They have 256Gb (bits, not bytes) at first, and will expand up to half a terabit in the future. All of these are of course in a single chip.
It’s entering the market way sooner than we thought too. Expected to be in the market later this year and to be in commercial volumes in the first half of 2017.
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