At the Hot Cips 33 conference where major microprocessor industry players and new IC innovations gather, Samsung has reported that they have finally successfully integrated its PIM-enabled High Bandwith Memory (HBM) into industry application.
In February, the company has introduced the industry’s 1st HBM-PIM module AquaBolt-XL into the Xilinx Virtex Ultrascale+(Alveo) AI accelerator that provides high-speed data processing with more than 2.5 times more performance while cutting down at most 60% power consumption. For a slight recap, the Acceleration DIMM (AXDIMM) which is the AquaBolt-XL’s official categorization name, integrates native processing onto the memory IC itself so that data movement can be minimized through earlier data processing performed by an AI engine found within the module itself.
Aside from immensely powering up the capabilities of industrial applications, Samsung will also be introducing the new LPDDR5-PIM mobile memory technology with similar performance gain tested within applications such as voice recognition, translation and chatbox services. By having another AI-based function available outside of, let say, a traditional CPU, SoC, or acceleration card, mobile applications can be built into a smaller scale while carrying the same or better performance through this tech. Perhaps this form of AI integration can be found in something else in the future?
The new LPDDR5-PIM is slated for production and standardization starting 1H next year.
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