For nearly all of our products these days, it comes with at least one chip that is soldered onto a PCB. These rather large chips are usually storage chips which are soldered onto the board using the BGA method – or “ball grid array” since there is an array of balls to hold the chip. Transcend is here recommending underfill and corner bond to further secure the chip further.
That’s because if there’s only BGA, it’s not the most secure method since the chip can be ripped off the PCB, perhaps because of bad BGA soldering or perhaps just the solder was too warmed up and was softened. By combining another method to bond the components onto the PCB, its strength is beyond the sum of its two parts.
More information can be found on the Transcend Embedded Solution page at https://www.transcend-info.com/Embedded/
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