Another innovative breakthrough in the digital memory technology field, Samsung has announced the newly developed High Bandwidth Memory chip with direct artificial intelligence (AI) integration.
Using the new Processing-In-Memory architecture as opposed to traditional Von Neumann where processor and memory are fitted apart, Samsung is able to address the current memory bandwidth and power challenges by packing a DRAM-optimized AI engine inside each memory bank with parallel processing capabilities, eliminating the needs to move unnecessary data across storage, processor and volatile memory. Paired with Samsung’s own BM2 Aquabolt solution, test results have shown more than 2x the performance with less energy consumption of over 70%.
Samsung is apparently working together with many currently deployed HPC and AI computing architectures and infrastructures and hopes to bring this technology to an extensive and broad adaptation to the mobile sector where each and every piece of ubiquitous hardware could utilize this piece of useful tech. A full validation process is expected to be completed by participating partners within the first half of 2021.
While this is certainly interesting to see, but with additional hardware implanted into memory banks that means it is going to be more expensive than ever and as being one of its kind currently, it is going to take some time for the industry to adapt and drive this technology into maturity. But hey, at least it is something new and money can buy down the line.
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